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Devcon® 5-Min Fast Dry Epoxy 28.4g

A rapid curing, general purpose epoxy adhesive/encapsulant. It forms a clear, hard, rigid bond or coating in minutes.

Features & Use

100% reactive, no solvents
Good dielectric strength
Cures fast for quick metal to metal bonding and repairs Pots and encapsulates electronic components and assemblies Seals against dust, dirt and combination Fast curing, thin set, bonding above 5°C
7 minute fixture time
Bonds metal, fabrics, ceramics, glass, wood and concrete (in combinations)

Product Code

DS-208

Technical Documents

Documents not available

Devcon® 5-Min Fast Dry Epoxy 28.4g
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